Important Dates

Final Submission Deadline:
Aug. 10  Aug. 25

Submission Acceptance Notification:
Sep. 25

Postdeadline Submission Deadline:
Oct. 8

Call For Papers

 
ACP/IPOC History

Workshops

DATE: 6/17/2020

Workshop 1: AI-based Optics

Workshop 2: Photonics for 6G: How and when?

Workshop 3: Security Solutions Enabled by Physics in Fiber

Workshop 4: Marriage between artificial intelligence and micro-/nano-photonics: happy or not?

Workshop 5: Workshop on Information Functional Materials and Devices

Workshop 6: Multiple Band Optical Communications and Networking

Workshop 7: Special Light Communications

Workshop 8: Data Center Optic Interconnection

Workshop 9: Wireless Optical Communication and Networking

Workshop 10: Workshop on Space Division Multiplexing Communication System

Workshop 11: Short-reach applications: Current status, Trend and Demand

Workshop 12: Photonics Research Workshop: Next-generation silicon photonics

  • AI-based Optics

    Organizer
    Alan P.K. Lau, The Hong Kong Polytechnic University, China

    Co-organizers
    Qunbi Zhuge, Shanghai Jiao Tong University, China

    Speakers
    Miquel Garrich, Huawei, France
    Jianqiang Li, Alibaba, USA
    Junjie Li, China Telecom, China
    Zuqing Zhu, University of Science and Technology of China, China
    Danshi Wang, Beijing University of Posts and Telecommunications, China
    Massimo Tornatore, Politecnico di Milano, Itlay
    Pesic Jelena, Nokia Bell Labs, France
    Vittorio Curri, Politecnico di Torino, Itlay

  • Photonics for 6G: How and when?

    Organizer
    Chao Shen, King Saud University, Saudi Arabia

    Co-organizers
    Zhenming Yu, Beijing University of Posts and Telecommunications, China
    Chao Shen, SaNoor Technologies Inc., Saudi Arabia

    Speakers
    Changyuan Yu, Hong Kong Polytechnic University, China
    Hongyan Fu, Tsinghua-Berkeley Shenzhen Institute, China
    Vladimir Kozlov, Lightcounting Corp, China
    Qinggui Tan, Academy of Space Information Systems, China
    Jing Zhang, University of Electronic Science and Technology of China, China
    Wei Wei, Beijing Institute of Technology, China
    Boon S. Ooi, KAUST, South Korea
    Ben Wu, Rowan University, USA

  • Security Solutions Enabled by Physics in Fiber

    Organizer
    Yongli Zhao, Beijing University of Posts and Telecommunications, China

    Co-organizers
    Reza Nejabati, University of Bristol, UK
    Lilin Yi, Shanghai Jiao Tong University, China
    Wei Chen, University of Science and Technology of China, China

    Speakers in Physical Layer Security
    Anbang Wang, Taiyuan University of Technology, China
    Lei Deng, Huazhong University of Science and Technology, China
    Xuelin Yang, Shanghai Jiao Tong University, China
    Tao Pu, PLA Army Engineering University, China
    Yajie Li, Beijing University of Posts and Telecommunications, China

    Speakers in Quantum Communications and Networks
    Zhenqiang Yin, University of Science and Technology of China, China
    Yongmei Sun, Beijing University of Posts and Telecommunications, China
    Zhangchao Ma, Beijing University of Science and Technology, China
    Masahiro Takeoka, National Institute of Information and Communications Technology, Japan
    Yi Qian, Wuhan Research Institute of Posts and Telecommunications, China
    Xiaosong Yu, Beijing University of Posts and Telecommunications, China

  • Marriage between artificial intelligence and micro-/nano-photonics: happy or not?

    Organizer
    Hongbo Sun, Tsinghua University, China

    Co-organizers
    Mable P. Fok, University of Georgia, USA
    Honghua Fang, Tsinghua University, China
    Qiming Zhang, University of Shanghai for Science and Technology, China
    Lili Gui, Beijing University of Posts and Telecommunications, China

    Speakers
    Bhavin J. Shastri, Queen's University, Canada
    Yuebing Zheng, The University of Texas at Austin, USA
    Keisuke Kojima, Mitsubishi Electric Research Laboratories, USA
    Richard Haglund, Vanderbilt University, USA
    Yichen Shen, Lightelligence, USA
    Alexandra Boltasseva, Purdue University, USA
    Xing Lin, Tsinghua University, China
    Andrew Forbes, University of the Witwatersrand, South Africa
    Zengguang Cheng, Fudan University, China
    Li Gao, Nanjing University of Posts and Telecommunications, China
    Cuicui Lu, Beijing Institute of Technology, China
    Chao Qian, Zhejiang University, China

  • Workshop on Information Functional Materials and Devices

    Organizer
    Sishen Xie, Institute of Physics CAS, China

    Co-organizers
    Weihua Tang, Beijing University of Posts and Telecommunications, China
    Jianhua Hao, The Hong Kong Polytechnic University, China
    Ting-Chang Chang, National Sun Yat-sen University, China
    Qixin Guo, Saga University, Japan

    Speakers
    Shifeng Zhou, South China University of Technology, China
    Yang Zhang, Nankai University, China
    Erjia Guo, Institute of Physics, CAS, China
    Gongxun Bai, China Jiliang University, China
    Wen Huang, University of Electronic Science and Technology of China, China
    Zhenping Wu, Beijing University of Posts and Telecommunications, China

  • Multiple band optical communications and networking

    Organizer
    Gangxiang Shen, Soochow University, Suzhou, China

    Co-organizers
    Vittorio Curri, Politecnico di Torino, Italy
    Liangjia Zong, Huawei Technology, China
    Antonio Napoli, Infinera, Germany

    Speakers
    Chao Lu, The Hong Kong Polytechnic University, China
    Ning Deng, Huawei, China
    Nicola Calabretta, TU/e, Netherlands
    Andrea D'Amico, Politecnico di Torino, Italy
    Forysiak, Wladek, Aston University, UK
    Mingyi Gao, Soochow University, China
    Guanshi Qin, Jilin University, China

  • Special Light Communications

    Organizer
    Nan Chi, Fudan University, China

    Co-organizers
    Gong-Ru Lin, National Taiwan University, China
    Boon Ooi, King Abdullah University of Science and Technology (KAUST), Saudi Arabia

    Speakers
    Zabih Ghassemlooy, Northumbria University, UK
    Bin Liu, Nanjing University, China
    Chi-Wai Chow, National Chiao-Tung University, China
    Chao Zhao, CAS & RWTH Aachen/Forschungszentrum, China & Germany
    Rami Elagandy, Yale, USA
    Jorge Holguin Lerma, Yale, USA
    Chao-Hsin Wu, National Taiwan University, China
    Xiaobin Sun, Fraunhofer, Scotland
    Hsin-Mu Tsai, National Taiwan University, China

  • Data Center Optic Interconnection

    Organizer
    Chao Lu, The Hong Kong Polytechnic University, China

    Co-organizers
    Zhaohui Li, Sun Yat-sen University, China
    Deming Liu, Huazhong University of Science and Technology, China
    Bingli Guo, Beijing University of Posts and Telecommunications, China

    Speakers
    Chuanchuan Yang, Peking University, China
    Zhongwei Tan, Hong Kong Polytechnic University, China
    Gangxiang Shen, Soochow University, China
    Wen Zhou, Fudan University, China
    Qinghua Tian, Beijing University of Post and Telecommunications, China
    Fan Li, Sun Yat-sen University, China
    Chongjin Xie, Alibaba Group, USA
    Xiaogeng Xu, Hisilicon OE, China

  • Wireless Optical Communication and Networking

    Organizer
    Lei Guo, Chongqing University of Posts and Telecommunications, China

    Co-organizers
    Tianshu Wang, Changchun University of Science and Technology, China
    Li Zeng, Huawei Technology, China
    Hui Yang, Beijing University of Posts and Telecommunications, China

    Speakers
    Mohamed-Slim Alouini, King Abdullah University of Science and Technology (KAUST) , Saudi Arabia
    Muhammad Bashir Salman, King Abdullah University of Science and Technology (KAUST) , Saudi Arabia
    Chathurika Ranaweera, Deakin University, Melbourne, Australia
    Li Zeng, Huawei, China
    Pham Tien Dat, National Institute of Information and Communications Technology, Japan
    Yejun Liu, Chongqing University of Posts and Telecommunications, China

  • Workshop on Space Division Multiplexing Communication System

    Organizer
    Zhaohui Li, Sun-Yat Sen University, China

    Co-organizers
    Xiaocong Yuan, Shenzhen University, China
    Siyuan Yu, Sun-Yat Sen University, China
    Guifang Li, University of Central Florida, USA

    Speakers in Section I: Space division multiplexing devices
    Yongmin Jung, University of Southampton, UK
    Kunimasa Saitoh, Hokkaido University, Japan
    Kin Seng Chiang, City University of Hong Kong ,China
    Ting Lei, Shenzhen University, China
    Yujie Chen, Sun Yat-sen University, China
    Ke Xu, Harbin Institute of Technology, Shenzhen, China
    Jiajing Tu, Jinan University, China
    Jiangbing Du, Shanghai Jiao Tong University, China

    Speakers in Section II: Space division multiplexing system
    Takayuki Mizuno, NTT Network Innovation Laboratories, Japan
    Andrew Forbes, University of the Witwatersrand, South Africa
    Davide Bacco, Technical University of Denmark, Denmark
    Yunfeng Huang, University of Science and Technology of China, China
    Jian Wang, Huazhong University of Science and Technology, China
    Jianping Li ,Guangdong University of Technology, China
    Jie Liu, Sun Yat-sen University ,China

  • Short-reach applications: Current status, Trend and Demand

    Organizer
    Fan Zhang, Peking University, China

    Co-organizers
    William Shieh, University of Melbourne, Australia
    Jiajia Chen, Chalmers University of Technology, Sweden

    Speakers
    Xiang Liu, Futurewei Technologies, USA
    Xiang Zhou, Google, USA
    Ming-jun Li, Corning, USA
    Hoon Kim, KAIST ,South Korea
    Yuki Yoshida, National Institute of Information and Communication Technology, Japan
    Tao Gui, Huawei, China
    Di Che, Bell Labs, USA
    Lilin Yi, Shanghai Jiao Tong University, China
    Chester Shu, Chinese University of Hong Kong, China
    Bill Corcoran, Monash University, Australia
    Chuan Bowen Sun, The University of Melbourne, Australia

Postdeadline Submission
Registration

Hosts:


Beijing University of Posts and Telecommunications

 


State Key Laboratory of Information Photonics and Optical Communications

 


State Key Laboratory of Optical Fibre and Cable Manufacture Technology

 

Co-Hosts:

 

 

Technical Sponsors:

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